List of Figures

Chapter 1: From the Industrial Era to the Information Age

Figure 1.1: First IBM PC, developed in 1981
Figure 1.2: Contemporary PC equipped with a wireless keyboard
Figure 1.3: First processor released by Intel
Figure 1.4: Intel Celeron 2 GHz processor

Chapter 2: Philosophy of Hardware Overclocking

Figure 2.1: Traditional solution to the problem of limited resources
Figure 2.2: Forecast for the evolution of Intel's semiconductor technology
Figure 2.3: Forecast for the evolution of RAM
Figure 2.4: Forecast for the evolution of the ATA interface

Chapter 3: Moderate and Extreme Overclocking Modes

Figure 3.1: Performance reserve for low-end and high-end processor in various overclocking modes
Figure 3.2: Two adjacent conductors that connect elements in the processor core
Figure 3.3: Three neighboring conductors that connect core elements
Figure 3.4: Two conductors, with consideration for dielectric influence
Figure 3.5: Transistor structure
Figure 3.6: Exponential growth of processor performance (based on IDF data)
Figure 3.7: Growth of the energy density inside a processor chip, compared to other densities (based on IDF data)
Figure 3.8: Core, cache memory, and buses of an Intel processor
Figure 3.9: CPU and RAM connection to the North Bridge
Figure 3.10: Organization of data transfer via the SDR SDRAM bus
Figure 3.11: Organization of data exchange via the DDR SDRAM bus
Figure 3.12: Box kit comprising a CPU and cooler
Figure 3.13: Box cooler
Figure 3.14: Cooling system for extreme processor overclocking (assembled)
Figure 3.15: Filling the cooling system with liquid nitrogen
Figure 3.16: Ice-crystal layer on the copper cooling container
Figure 3.17: Motherboard covered with frost
Figure 3.18: Frozen thermal paste on the heat-dissipating plate of the processor
Figure 3.19: Parameters of Intel Celeron 1.8 GHz overclocked to 2,519.91 MHz
Figure 3.20: Results of testing the overclocked CPU using SiSoftware Sandra
Figure 3.21: Parameters of Intel Pentium 4 2.53 GHz overclocked to the maximum frequency of 3,524.38 MHz
Figure 3.22: Parameters of Intel Pentium 4 3.06 GHz overclocked to 4,599.85 MHz
Figure 3.23: Parameters of AMD Athlon XP 1700+ overclocked to 3,107.05 MHz
Figure 3.24: Results of Dhrystone and Whetstone benchmark AMD Athlon XP 1700+ overclocked to 3,107.05 MHz
Figure 3.25: Integer and floating-point results of testing AMD Athlon XP 1700+ overclocked to 3,107.05 MHz
Figure 3.26: RAM results of testing AMD Athlon XP 1700+ overclocked to 3,107.05 MHz

Chapter 4: Main Components and the Optimal Choice

Figure 4.1: Pentium III processor with the SECC2 (Slot 1) form factor, heatsink, and fan
Figure 4.2: Slot 1 processor slot
Figure 4.3: Pentium III processor with the FC-PGA (Socket 370) form factor
Figure 4.4: Socket 370 processor slot
Figure 4.5: Celeron processor with the FC-PGA2 (Socket 370) form factor
Figure 4.6: Changing the core supply voltage, depending on the consumed current (Icore), in accordance with the 8.5 specification
Figure 4.7: Pentium III (Coppermine, Socket 370) and Pentium 4 (Willamette, Socket 423) processors
Figure 4.8: Pentium 4 (Northwood, Socket 478) processor
Figure 4.9: Socket 478 processor slot
Figure 4.10: Pentium 4 3 GHz is intended to operate at a 200 MHz bus frequency, ensuring a data-transfer rate of 800 MHz
Figure 4.11: Socket A (462 pins) processor slot
Figure 4.12: Athlon (Thunderbird, Socket A) processor
Figure 4.13: Duron (Spitfire, Socket A) processor
Figure 4.14: Athlon XP (Palomino, Socket A) processor
Figure 4.15: Athlon XP (Thoroughbred, Socket A) processor
Figure 4.16: Athlon XP (Barton, Socket A) processor
Figure 4.17: Athlon XP 2700+ (Thoroughbred) marking— "3D" in the top-left group stands for 256 KB L2 and 133 MHz FSB
Figure 4.18: Athlon XP 3000+ (Barton) marking— "4D" in the top-left group stands for 512 KB L2 and 133 MHz FSB
Figure 4.19: Athlon XP 3200+ (Barton) marking— "4E" in the top-left group stands for 512 KB L2 and 200 MHz FSB
Figure 4.20: VIA C3 (Ezra, Socket 370) processor
Figure 4.21: SDRAM module
Figure 4.22: RIMM module
Figure 4.23: DDR SDRAM module
Figure 4.24: Fragment of the PC3200 (DDR400) module
Figure 4.25: Structure of a computer based on the i440BX AGPset chipset
Figure 4.26: Structure of a computer based on the i845PE chipset
Figure 4.27: Structure of a computer based on the i875P chipset
Figure 4.28: Structure of a computer based on the Apollo KT400 chipset
Figure 4.29: Abit IT7-MAX2 Rev. 2.0 motherboard
Figure 4.30: Asus P4P800 Deluxe motherboard
Figure 4.31: Asus P4C800 Deluxe motherboard
Figure 4.32: Intel D845PEBT2 motherboard
Figure 4.33: Intel D875PBZ motherboard
Figure 4.34: Fragment of a power supply unit with (left) and without (right) a filter
Figure 4.35: Enermax EG365AX-VE power supply unit
Figure 4.36: Internal structure of the Enermax EG365AX-VE power supply unit
Figure 4.37: Internal structure of the KM Korea GP-300ATX power supply unit
Figure 4.38: Internal structure of the Delta Electronics DPS-300TB power supply unit
Figure 4.39: Internal structure of the IPower LC-B250ATX power supply unit

Chapter 5: BIOS as Additional Performance Reserve

Figure 5.1: Entering the name of the file containing the updated BIOS code
Figure 5.2: Writing the updated BIOS code into flash ROM
Figure 5.3: Results of the CPUmark 99 test of a computer with different BIOS versions
Figure 5.4: Results of the FPU WinMark test of a computer with different BIOS versions
Figure 5.5: Results of the 3DMark2001 SE Pro test of a computer with different BIOS versions

Chapter 6: Computer Hardware Monitoring

Figure 6.1: Diagram of computer hardware monitoring
Figure 6.2: Including hardware-monitoring and input/output chips in the computer architecture
Figure 6.3: Hardware-monitoring chip on the Asus motherboard
Figure 6.4: Internal structure of the W83782D chip and diagram of probe connections
Figure 6.5: Internal structure of the LM78/LM79 chip and diagram of probe connections
Figure 6.6: Methods for connecting the W83782D chip with different semiconductor thermal sensors— the 2N3904 transistor (a) and the thermal diode built into the Pentium III chip (b)
Figure 6.7: External temperature sensor for Slot 1 processors
Figure 6.8: External temperature sensor installed within the Socket A slot
Figure 6.9: Hardware monitoring in BIOS Setup
Figure 6.10: Typical screenshot of the Winbond Hardware Doctor application
Figure 6.11: Upper and lower limits of the value being monitored
Figure 6.12: Upper temperature limit
Figure 6.13: Lower limit of the fan rotation speed
Figure 6.14: Warning message
Figure 6.15: Operation of the MBM program (v. 4.17)
Figure 6.16: Customization of the MBM program (v. 5.05)
Figure 6.17: Operation of the MBM program (v. 5.05)
Figure 6.18: MBM (v. 5.05)
Figure 6.19: Operation of the Shepherd program
Figure 6.20: Temperature graph built using Shepherd
Figure 6.21: SmartDoctor at work

Chapter 7: Stages of PC Overclocking and Testing

Figure 7.1: Main window of the WinBench 99 program
Figure 7.2: Choosing WinBench 99 tests
Figure 7.3: Example of a WinBench 99 test
Figure 7.4: CheckIt at work
Figure 7.5: SYSmark 2002 test
Figure 7.6: 3DMark2001 SE
Figure 7.7: Window of the 3DMark2001 SE test
Figure 7.8: lometer test
Figure 7.9: Choosing a test in SiSoftware Sandra 2003
Figure 7.10: CPU Arithmetic Benchmark test of SiSoftware Sandra 2003
Figure 7.11: Memory Bandwidth Benchmark test of SiSoftware Sandra 2003
Figure 7.12: Network/LAN Bandwidth Benchmark test of SiSoftware Sandra 2003
Figure 7.13: Audio compression using the Audiograbber program and the LAME codec
Figure 7.14: CPUmark 99 test
Figure 7.15: Monitoring two parameters
Figure 7.16: Adding a parameter in the System Monitor program
Figure 7.17: Monitoring four parameters
Figure 7.18: Task Manager monitors the CPU and RAM workload
Figure 7.19: Task Manager's list of active processes and the resources they consume

Chapter 8: Approaches to Processor Overclocking

Figure 8.1: Setting the FSB frequency using DIP switches
Figure 8.2: Setting the FSB frequency using BIOS Setup
Figure 8.3: Overclocking Celeron (Northwood) (tested using SYSmark 2002)
Figure 8.4: Overclocking Celeron (Northwood) (tested using 3DMark2001)
Figure 8.5: Overclocking Duron by increasing the bus frequency (tested using CPUmark 99)
Figure 8.6: Overclocking Athlon (Thunderbird) by increasing the bus frequency (tested using CPUmark 99)
Figure 8.7: Locations of L1 bridges
Figure 8.8: Cut L1 bridges of Duron
Figure 8.9: Restored L1 bridges of Duron
Figure 8.10: Cut L1 bridges of Athlon XP (Palomino)
Figure 8.11: L1 bridges of Athlon XP (Palomino), restored using a special glue
Figure 8.12: Athlon XP (Thoroughbred) (the marked fragment contains the L3 bridges)
Figure 8.13: L3 bridge responsible for the multiplier of Athlon XP (Thoroughbred)
Figure 8.14: L1 bridges that do not require restoration
Figure 8.15: Overclocking Duron by changing the multiplier
Figure 8.16: Overclocking of Athlon (Thunderbird) by changing the multiplier
Figure 8.17: Overclocking Duron using both methods
Figure 8.18: Celeron installed in Socket 370
Figure 8.19: Fragment of the contact map of Celeron (Tualatin)
Figure 8.20: Celeron (Tualatin) (view of the contacts side)
Figure 8.21: Fragment of Celeron (Tualatin), with the VID and Vss contacts marked
Figure 8.22: Fragment of Celeron, with the contact marked that allows you to set the FSB frequency to 133 MHz
Figure 8.23: Implementation of the FSB frequency of 133 MHz and core voltage of 1.7 V
Figure 8.24: Implementation of the FSB frequency of 133 MHz and core voltage of 1.75 V
Figure 8.25: L1 and L11 bridges of Athlon XP (Palomino)
Figure 8.26: L3 and L11 bridges of Athlon XP (Palomino)
Figure 8.27: Generation of the operating frequency in Pentium 4
Figure 8.28: Modification of the clock signal supplied to Pentium 4 by the thermal control system
Figure 8.29: Zalman FanMate regulator
Figure 8.30: MIR-253 thermally isolated chamber from Sanyo
Figure 8.31: Influence of hyperthreading technology on the CPU temperature
Figure 8.32: Influence of the Thermal Monitor and the Thermal Control Circuit on the CPU performance (1 = temperature of the ambient air, 2 = temperature of the air within the computer case, 3 = CPU temperature, and 4 = speed in the game test)
Figure 8.33: Results of the CPU RightMark 2 RC3 test (Intel Pentium 4 3.06 GHz)
Figure 8.34: Standard cooler supplied with Pentium processors
Figure 8.35: Parameters of Intel Pentium 4 1.6 GHz
Figure 8.36: Influence of the Thermal Monitor and the Thermal Control Circuit on the performance of Pentium 4 1.6 GHz (1 = CPU temperature, and 2 = speed shown by the Unreal Tournament test)
Figure 8.37: Results of the CPU RightMark 2 RC3 test (Intel Pentium 4 1.6 GHz)
Figure 8.38: Parameters of Intel Pentium 4 1.8 GHz
Figure 8.39: Influence of the Thermal Monitor and the Thermal Control Circuit on the performance of Pentium 4 1.8 GHz (1 = CPU temperature, and 2 = speed shown in the Unreal Tournament test)
Figure 8.40: Results of the CPU RightMark 2 RC3 test (Intel Pentium 4 1.8 GHz)
Figure 8.41: Results of the CPU RightMark 2 RC3 test (Intel Pentium 4 2.0 GHz)
Figure 8.42: Influence of the Thermal Monitor and the Thermal Control Circuit on the performance of Pentium 4 2.0 GHz (1 = CPU temperature, and 2 = speed shown in the Unreal Tournament test)
Figure 8.43: Results of the CPU RightMark 2 RC3 test (Intel Pentium 4 2.0 GHz)

Chapter 9: Software Tools for Cooling

Figure 9.1: CpuIdle window
Figure 9.2: CpuIdle at work
Figure 9.3: CPU temperature in an overclocked system without software cooling
Figure 9.4: CPU temperature in an overclocked system with software cooling
Figure 9.5: Customizing the CpuIdle parameters
Figure 9.6: Comparison of the CPUmark 99 test results
Figure 9.7: Customizing the indicator parameters
Figure 9.8: Customizing the temperature control parameters

Chapter 10: Choosing Cooling Devices and Parameters

Figure 10.1: Heatsink for a processor
Figure 10.2: Fan for a CPU cooler
Figure 10.3: Intel cooler recommended for Celeron 2 GHz
Figure 10.4: Socket 478 slot and levers for fastening a cooler
Figure 10.5: Cooler for a Pentium 4 3 GHz processor installed on the levers on the motherboard
Figure 10.6: Cooler for Pentium 4 3 GHz (underside view)
Figure 10.7: Igloo 4200 cooler from GlacialTech
Figure 10.8: Igloo 4300 cooler from GlacialTech
Figure 10.9: Diamond 4000 cooler from GlacialTech
Figure 10.10: TTC-W2T cooler from Titan
Figure 10.11: TTC-W5TB cooler from Titan
Figure 10.12: Volcano 478 cooler from Thermaltake
Figure 10.13: Dragon 478 cooler from Thermaltake
Figure 10.14: Results of testing coolers for Socket 478 processors
Figure 10.15: Speeze 5R266B1H3 (EagleStream) cooler from Fanner
Figure 10.16: ND18-715CA cooler from EverCool
Figure 10.17: KN02 cooler from Neng Tyi
Figure 10.18: KN02 heatsink from Neng Tyi
Figure 10.19: FSCUG9C-6FC cooler from ElanVital
Figure 10.20: Results of testing coolers for Socket A processors
Figure 10.21: Heatsink installed on an Intel 875 chipset
Figure 10.22: Cooler, with a fan, installed on the North Bridge
Figure 10.23: Cooler installed on a video adapter
Figure 10.24: Video adapter equipped with the OTES cooling system
Figure 10.25: HardCano 3 cooler for hard disks
Figure 10.26: System cooler from Thermaltake

Chapter 11: Problems with using Thermoelectric Elements

Figure 11.1: Arrangement for measuring Peltier heat (Cu — copper, Bi — bismuth)
Figure 11.2: Release of Peltier heat at the contact of n- and p-type semiconductors
Figure 11.3: Absorption of Peltier heat at the contact of n- and p-type semiconductors
Figure 11.4: Using p- and n-semiconductors in thermoelectric refrigerators
Figure 11.5: Structure of a Peltier module
Figure 11.6: External view of a typical Peltier module
Figure 11.7: Cascaded Peltier modules
Figure 11.8: External view of a cooler with a Peltier module
Figure 11.9: Semiconductors of p- and n-types in a Peltier module
Figure 11.10: Tiny Peltier module
Figure 11.11: Shaped Peltier module
Figure 11.12: Peltier module with one ceramic platter removed
Figure 11.13: Cascaded Peltier module
Figure 11.14: Thermoelectric characteristics of a Peltier module
Figure 11.15: Incorrect usage of a large Peltier module
Figure 11.16: Correct usage of a large Peltier module with heat-conductive padding (Cu)
Figure 11.17: Isolating cold areas of the cooling system by using foam rubber (Cu is the heat-conductive padding)
Figure 11.18: Thermoelectric modules from Supercool
Figure 11.19: Components of a water cooling system
Figure 11.20: Element of a two-circuit water cooling system
Figure 11.21: External view of the PAP2X3B cooler

Chapter 12: Overclocking and Fine-Tuning RAM

Figure 12.1: RAM module
Figure 12.2: KX7-333 motherboard from Abit
Figure 12.3: DRAM Clock/Drive Control menu in BIOS Setup
Figure 12.4: Performance as parameters are changed (SiSoftware Sandra, integer)
Figure 12.5: Performance as parameters are changed (SiSoftware Sandra, floating point)
Figure 12.6: Performance as parameters are changed (Quake III)
Figure 12.7: Performance growth caused by increased frequency (SiSoftware Sandra, integer)
Figure 12.8: Performance growth caused by increased frequency (SiSoftware Sandra, floating point)
Figure 12.9: Performance growth caused by increased frequency (Quake III)
Figure 12.10: Computer performance with FSB and memory frequencies of 166 MHz (SiSoftware Sandra)

Chapter 13: Video Subsystem Overclocking

Figure 13.1: Results of the 3D WinBench 98 (3D processing) test
Figure 13.2: Results of the 3D WinBench 98 (3D scene) test
Figure 13.3: Results of the WinBench 98 (3D WinMark) test
Figure 13.4: Window of the RivaTuner program
Figure 13.5: Selecting low-level frequency settings
Figure 13.6: Settings window for the video processor core and video memory
Figure 13.7: Specifying frequencies (before change)
Figure 13.8: Specifying frequencies (after change)
Figure 13.9: Test results using 3DMark2000 (1,024 × 786 × 16 bit)
Figure 13.10: Test results using 3D WinBench/WinMark 2000
Figure 13.11: Test results using 3DMark2001 SE Pro
Figure 13.12: Incorrect operation of a driver
Figure 13.13: GeForce FX 5800 Ultra video adapter
Figure 13.14: Setting GeForce FX 5800 Ultra clock frequencies using driver functionality
Figure 13.15: Setting GeForce FX 5800 Ultra operating modes via the driver
Figure 13.16: On-screen display of the test image
Figure 13.17: Dependence of the image quality on the mode, with trilinear filtering
Figure 13.18: Dependence of the image quality on the mode, with trilinear and anisotropic filtering
Figure 13.19: Setting GeForce FX 5600 Ultra operating modes via the driver

Chapter 14: Hardware Acceleration of Video Adapters

Figure 14.1: VisionTek GeForce3 adapter
Figure 14.2: Design of stabilizer connection
Figure 14.3: SC1175CSW chip
Figure 14.4: Method of connecting a chip in the mode with two independent channels
Figure 14.5: Additional resistance (view of contact 3)
Figure 14.6: Additional resistance (view of contacts 18 and 20)
Figure 14.7: Cooling facilities
Figure 14.8: Leveled and polished video chip
Figure 14.9: Asus V8200 adapter
Figure 14.10: Resistor correcting the video core voltage
Figure 14.11: Raising the memory supply voltage
Figure 14.12: Raising the memory supply voltage (continued)
Figure 14.13: Performance evaluation in 16-bit modes (1–3 show the core/memory frequency in megahertz)
Figure 14.14: Performance evaluation in 32-bit modes (1–3 show the core/memory frequency in megahertz)
Figure 14.15: Fragment of the stabilizer connection design
Figure 14.16: Fragment of a connection design with two independent channels
Figure 14.17: Voltage stabilizers of the video memory (1) and core (2)
Figure 14.18: Voltage stabilizers of the video memory (1) and core (2) (GeForce3 reference design)
Figure 14.19: Voltage stabilizers of the video memory (1) and core (2) (Ti200 reference design)
Figure 14.20: Voltage stabilizers of the video memory (1) and core (2) (Ti500 reference design)
Figure 14.21: Raising the video-memory supply voltage (GeForce3/Ti200/Ti500 reference design)
Figure 14.22: Raising the video-core supply voltage (GeForce3/Ti200/Ti500 reference design)
Figure 14.23: Voltage stabilizers on an Asus V8200 T5 adapter (Ti500 reference design)
Figure 14.24: Detailed view of voltage stabilizers on an Asus V8200 T5 adapter
Figure 14.25: Typical connection design of the AMS1505 chip
Figure 14.26: Voltage stabilizers on an Asus V8200 T2 adapter (Ti200 reference design)
Figure 14.27: Detailed view of voltage stabilizers on an Asus V8200 T2 adapter
Figure 14.28: Raising video-memory and video-core supply voltages on Asus V8200 T2/T5
Figure 14.29: Voltage stabilizer for 2.5 V is missing on Asus V8200 T2
Figure 14.30: Raising the memory supply voltage on Asus V8200 T5
Figure 14.31: Test results obtained using 3DMark2001 (Car Chase)
Figure 14.32: Test results obtained using 3DMark2001 (Dragothic)
Figure 14.33: VisionTek Xtasy GeForce4 Ti4400 adapter
Figure 14.34: Increasing the video-core supply voltage on VisionTek Xtasy GeForce4 Ti4400
Figure 14.35: Typical connection design for the SC1102CS chip
Figure 14.36: VisionTek Xtasy GeForce4 Ti4400 bridges (front side)
Figure 14.37: VisionTek Xtasy GeForce4 Ti4400 bridges (underside)
Figure 14.38: Increasing the video-memory supply voltage on VisionTek Xtasy GeForce4 Ti4400
Figure 14.39: Additional diode
Figure 14.40: Video chip after its surface has been leveled and polished
Figure 14.41: Thermaltake Mimi Copper Orb cooler
Figure 14.42: VisionTek Xtasy GeForce4 Ti4400 with a modified cooling system
Figure 14.43: Test results obtained using Codecult Codecreatures
Figure 14.44: Test results obtained using 3DMark2001 (Nature)
Figure 14.45: VisionTek Xtasy GeForce4 Ti4600 adapter (front side)
Figure 14.46: VisionTek Xtasy GeForce4 Ti4600 adapter (underside)
Figure 14.47: VisionTek Xtasy GeForce4 Ti4600 after modification
Figure 14.48: Fragment of the SC1102CS connection design
Figure 14.49: Voltage stabilizer for the SC1102CS chip
Figure 14.50: Fragment of the SC1175CSW connection design
Figure 14.51: Voltage stabilizer of the video core
Figure 14.52: Test results obtained using 3DMark2001 (Nature)
Figure 14.53: Test results obtained using Codecult Codecreatures
Figure 14.54: Sapphire adapter based on Radeon 9500 (front side)
Figure 14.55: Sapphire adapter based on Radeon 9500 (underside)
Figure 14.56: Positions of resistors on the Radeon 9500 chip
Figure 14.57: Detailed view of resistors on the Radeon 9500 chip

Chapter 15: Technology and Problems of Overclocking IDE Drives

Figure 15.1: Test results of hard disk performance using WinCheckIt
Figure 15.2: Test results of hard disk performance using WinMark 99 (business disk)
Figure 15.3: Test results of hard disk performance using WinMark 99 (high-end disk)
Figure 15.4: MT1508E chip from MediaTek
Figure 15.5: LC898094 chip from Sanyo
Figure 15.6: Teac CD-W548E CD-RW drive (a) and MediaTek chipset (b and c)
Figure 15.7: TDK CyClone 401248B CD-RW drive
Figure 15.8: Asus CRW4012A CD-RW drive

Chapter 16: Overclocking to Achieve Processor and Motherboard Compatibility

Figure 16.1: Results of testing with a screen resolution of 1,600 × 1,200
Figure 16.2: Results of testing with a screen resolution of 1,024 × 768
Figure 16.3: Unlocking the multiplier for a processor based on the Thoroughbred core
Figure 16.4: Parameters of an overclocked processor based on the Thoroughbred core
Figure 16.5: Test results at a CPU frequency of 1,930 MHz (203 MHz × 9.5)

Chapter 17: Solving Problems by Anti-Overclocking

Figure 17.1: Fragment of BIOS Setup responsible for setting the FSB frequency
Figure 17.2: Fragment of BIOS Setup responsible for enabling or disabling cache memory
Figure 17.3: Curves of equal volume
Figure 17.4: Coolers for Intel 486-100 and Intel Pentium 4 3.06 GHz processors
Figure 17.5: Circuit design ensuring fan startup, with subsequent decrease of the supply voltage to the required level
Figure 17.6: Thermal sensor built into the cooler
Figure 17.7: Schematic circuit of a thermal regulator based on an LM311 chip
Figure 17.8: Wiring diagram of a thermal regulator based on an LM311 chip
Figure 17.9: Principal diagram of a thermal regulator based on transistors
Figure 17.10: Results of modeling the design using PSpice software
Figure 17.11: Wiring plan of a thermal regulator based on transistors

Chapter 18: Examples and Analysis of PC Overclocking

Figure 18.1: Pentium II 300 MHz processor performance (FPU WinMark)
Figure 18.2: Pentium II 300 MHz hard-disk performance (WinMark 99 business disk)
Figure 18.3: Pentium II 300 MHz hard-disk performance (WinMark 99 high-end disk)
Figure 18.4: Pentium II 300 MHz test results (WinMark 99 high-end disk)
Figure 18.5: Pentium II 333 MHz test results
Figure 18.6: Opening the SoftMenu III Setup menu in BIOS Setup (Pentium III 500E)
Figure 18.7: Setting the recommended parameters in SoftMenu III Setup (Pentium III 500E)
Figure 18.8: Establishing the overclocking mode in SoftMenu III Setup (Pentium III 500E)
Figure 18.9: Pentium III 500E test results (CPUmark 99)
Figure 18.10: Pentium III 500E test results (FPU WinMark)
Figure 18.11: Opening the SoftMenu III Setup menu in BIOS Setup (Pentium III 550E)
Figure 18.12: Setting the recommended parameters in SoftMenu III Setup (Pentium III 550E)
Figure 18.13: Establishing the overclocking mode in SoftMenu III Setup (Pentium III 550E)
Figure 18.14: Pentium III 550E test results (CPUmark 99)
Figure 18.15: Pentium III 550E test results (FPU WinMark)
Figure 18.16: Establishing the overclocking mode in SoftMenu III Setup (Pentium III 700E)
Figure 18.17: Pentium III 700E test results (CPUmark 99)
Figure 18.18: Pentium III 700E test results (FPU WinMark)
Figure 18.19: Pentium III 800EB test results (CPUmark 99)
Figure 18.20: Pentium III 800EB test results (FPU WinMark)
Figure 18.21: Celeron 533 MHz test results (SiSoftware Sandra)
Figure 18.22: Celeron 533 MHz test results (3DMark2000)
Figure 18.23: Celeron 533 MHz test results (Quake III)
Figure 18.24: Celeron 600 MHz test results (CPUmark 99)
Figure 18.25: Celeron 600 MHz test results (FPU WinMark)
Figure 18.26: Pentium III 1.13 GHz test results (CPUmark 99)
Figure 18.27: Pentium III 1.13 GHz test results (FPU WinMark)
Figure 18.28: Celeron 1.3 GHz test results (CPUmark 99)
Figure 18.29: Celeron 1.3 GHz test results (FPU WinMark)
Figure 18.30: Celeron 1.3 GHz test results (WinMark 99 business disk)
Figure 18.31: Implementing the 133 MHz FSB frequency and 1.75 V core supply
Figure 18.32: Modified Celeron 1.3 GHz test results (CPUmark 99)
Figure 18.33: Modified Celeron 1.3 GHz test results (FPU WinMark)
Figure 18.34: Pentium 4 1.5 GHz test results (CPUmark 99)
Figure 18.35: Pentium 4 1.5 GHz test results (FPU WinMark)
Figure 18.36: Pentium 4 1.5 GHz test results (3DMark2000)
Figure 18.37: Pentium 4 1.7 GHz test results (Business Winstone 2001)
Figure 18.38: Pentium 4 1.7 GHz test results (SYSmark 2000)
Figure 18.39: Pentium 4 1.7 GHz test results (3DMark2001)
Figure 18.40: Pentium 4 2.2 GHz processor
Figure 18.41: Pentium 4 2.2 GHz test results (3DMark2000)
Figure 18.42: Pentium 4 2.2 GHz test results (CPUmark 99)
Figure 18.43: Pentium 4 2.2 GHz test results (Video 2000)
Figure 18.44: Cooler for Pentium 4 3.0 GHz with hyperthreading technology (underside view)
Figure 18.45: Parameters for Pentium 4 3.0 GHz with hyperthreading technology (WCPUID)
Figure 18.46: Pentium 4 3.0 GHz test results (CPUmark 99)
Figure 18.47: Pentium 4 3.0 GHz test results (3DMark2001 SE Pro)
Figure 18.48: Pentium 4 3.0 GHz test results (SiSoftware Sandra memory bandwidth benchmark)
Figure 18.49: Parameters for Celeron 2.0 GHz (WCPUID)
Figure 18.50: Celeron 2.0 GHz test results (CPUmark 99)
Figure 18.51: Celeron 2.0 GHz test results (3DMark2001 SE Pro)
Figure 18.52: Celeron 2.0 GHz test results (SiSoftware Sandra memory bandwidth benchmark)
Figure 18.53: Celeron 2.0 GHz test results (SYSmark 2002 ICC)
Figure 18.54: Athlon (Thunderbird) processor
Figure 18.55: Abit KT7 motherboard
Figure 18.56: Titan TTC-D2T cooler
Figure 18.57: Hard thermal sensor on the Abit KT7 motherboard
Figure 18.58: Athlon 700 results after increasing the bus frequency (CPUmark 99)
Figure 18.59: Athlon 700 results after increasing the bus frequency (FPU WinMark)
Figure 18.60: Bridges on the Athlon processor
Figure 18.61: Athlon 700 results after changing the multiplier (CPUmark 99)
Figure 18.62: Athlon 700 results after changing the multiplier (FPU WinMark)
Figure 18.63: Athlon 700 results after combined overclocking (CPUmark 99)
Figure 18.64: Athlon 700 results after combined overclocking (FPU WinMark)
Figure 18.65: Duron 650 test results (CPUmark 99)
Figure 18.66: Duron 650 test results (FPU WinMark)
Figure 18.67: Duron 600 processor
Figure 18.68: Soltek SL-75KV+ motherboard
Figure 18.69: Abit KT7 motherboard
Figure 18.70: Titan TTC-D2T cooler
Figure 18.71: Flexible thermal sensor on the Soltek SL-75KV+ motherboard
Figure 18.72: Rigid thermal sensor on the Abit KT7 motherboard
Figure 18.73: DIP switches on the Soltek SL-75KV+ motherboard (SW1 is marked)
Figure 18.74: Duron 600 (Abit KT7) after increasing the bus frequency (CPUmark 99)
Figure 18.75: Duron 600 (Abit KT7) after increasing the bus frequency (FPU WinMark)
Figure 18.76: Duron 600 (Soltek SL-75KV+) after increasing the bus frequency (CPUmark 99)
Figure 18.77: Duron 600 (Soltek SL-75KV+) after increasing the bus frequency (FPU WinMark)
Figure 18.78: Initial state of the L1 bridges on the Duron surface
Figure 18.79: L1 bridges with restored contacts on Duron
Figure 18.80: DIP switches on the Soltek SL-75KV+ motherboard (SW2 is marked)
Figure 18.81: Duron 600 (Abit KT7) after changing the multiplier (CPUmark 99)
Figure 18.82: Duron 600 (Abit KT7) after changing the multiplier (FPU WinMark)
Figure 18.83: Duron 600 (Soltek SL-75KV+) after changing the multiplier (CPUmark 99)
Figure 18.84: Duron 600 (Soltek SL-75KV+) after changing the multiplier (FPU WinMark)
Figure 18.85: Duron 600 (Soltek SL-75KV+) after combined overclocking (CPUmark 99)
Figure 18.86: Duron 600 (Soltek SL-75KV+) after combined overclocking (FPU WinMark)
Figure 18.87: Duron 600 (Abit KT7) after combined overclocking (CPUmark 99)
Figure 18.88: Duron 600 (Abit KT7) after combined overclocking (FPU WinMark)
Figure 18.89: Thermaltake Volcano 7 cooler
Figure 18.90: Athlon XP 1500+ test results (CPUmark 99)
Figure 18.91: Athlon XP 1500+ test results (3DMark2001 SE Pro)
Figure 18.92: Athlon XP 1500+ test results (SiSoftware Sandra memory bandwidth benchmark)
Figure 18.93: Athlon XP 1500+ test results (SYSmark 2002 ICC)
Figure 18.94: Athlon XP 2200+ test results (CPUmark 99)
Figure 18.95: Athlon XP 2200+ test results (3DMark2001 SE Pro)
Figure 18.96: Athlon XP 2200+ test results (SYSmark 2002 ICC)
Figure 18.97: VIA C3 800 MHz test results (CPUmark 99)
Figure 18.98: VIA C3 800 MHz test results (FPU WinMark)
Figure 18.99: VIA C3 800 MHz test results (WinMark 99 business disk)